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正型光阻劑

 

負型光阻劑
  提高光阻烘烤溫度
光阻洗邊液
  平坦化阻劑
  Spin-On Glass
  Spin-On Dopants
  顯像液
  光阻剝離液
  高透明度聚硫亞氨光阻
   
   
   
   
   
   
   
   
   
   
   
   
   
   

   

   
 
 
 
當光阻內的溶劑蒸發後,晶圓被光阻覆蓋。 在自旋塗佈後,晶圓靠近邊緣的兩側會被光阻所覆蓋;在後續的蝕刻或是離子佈值製程中,機械式的晶圓處理機,機器人手指或是晶圓夾鉗,會撕裂晶圓邊緣的光阻堆積物而造成微粒狀物質的污染,必須採用邊緣球狀物移除(EBR,Edge Bead Removal)避免光阻在邊緣的堆積。

Edge bead removal should be avoided especially for thicker films.

Edge Bead Removers

Applications: Removal of a resist buildup from top and bottom edges of coated substrate.
Properties: Liquid solvent.
Impact on productivity:
1 Elimination of contamination source to wafer handling equipment. 2 Elimination of particle shedding source.

Edge Bead Removers

For Positive Resists For Negative Resists
EBR1 EBR2

Resist Developers

Applications:
1 Development of resist pattern. 2 Removal of PC3-6000 film after back grinding or dicing processes.
Properties: Aqueous, basic solution.
Impact on productivity:
1 Application of single developer for both positive and negative resists.2
Elimination of solvents in removal of PC3-6000 film.

Resist Developers

RD3 RD6
: Alkaline Metal Containing TMAH Containing

Resist Removers

Applications: Removal of resist pattern after processing.
Properties: Liquid.
Impact on productivity: Reduction of time to remove resist.

Resist Removers

RR3 RR4
:
Aqueous, Basic Solution DMSO-based Solution

 

 Edge Bead Removers

 Applications

Applicable for removal of resists from top and bottom edges of coated substrate during coating with negative or positive resists.

Necessity of Chemical Edge Bead Removal in Modern Day Lithographic Processing



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