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抑制電滲透流

 

披覆保護層
  壓印光子晶體結構

 

介電層凹陷孔洞填補

 

乾蝕刻圖案光罩
  絕緣層上覆矽
  低光耗損耐高溫
  微機電封裝
  次微米製程填隙
  退火時間與溫度
   
   
  Interdigitated back passivated contact (IBPC) solar cell
   
  Ga2O3 MOSFETs
   
  Overcoat Layer for SiO2 Ridge Waveguides 
   
  Intermediate layer wafer bonding
   
        
  Inductively coupled plasma
  CF4 plasma etching
   
  BHF 二氧化矽蝕刻液 

   

   
 
 
 

旋塗式玻璃SOG (Spin-on glass)是液態SiO2晶片旋塗SOG後可增加平坦性。為將SOG轉換成固態SiO2層,必須將晶片置於400~450°C的爐管,蒸除SOG內的溶劑

旋塗式玻璃 (spin-on glass; SOG) 是形成薄膜也是平坦化一種方式,將溶於溶劑中的介電物質旋轉塗佈在需要平坦化的晶片上,使介電物質隨著溶劑填入溝渠中,再經過高溫固化,形成近似二氧化矽的物質在晶片上,讓表面輪廓比較平滑達到局部平坦化的目的,使後續的製程得以順利進行。

作為無機材料,
SOG 具有出色的抗等離子蝕刻和對矽的選擇比。

 

 Spin-On Glass For Interlevel Dielectric and Protective Coating Applications

 Thickness Range  0.2 - 1.0 µm
 Performance  Low dielectric constant.
 Low tensile stress.
 Excellent adhesion to substrates.
 Superior shelf life during storage at room temperature.
 State-of-the-art planarization; controlled film thickness
 Excellent gap fill; very low defect density
 Choice of carrier solvent systems
Refractive index  From 1.25 up to 1.85. 
 Applications  Dielectric smoothing layer for multilevel interconnects.
 Protective coating.
 Planarization Trench Fill, Smoothing & Hard masks
 High and low refractive index materials
   


Silicates                             (SiO4)4 [SiO2]n 0.12 - 0.3 µm
Phosphosilicates             [SiO2]n 0.05 - 0.23 µm
Methylsiloxanes                [H3CSiO2]m[SiO2]n-m 0.14 - 0.4 µm
Methylsilsesquioxanes   [H3CSiO3/2]n 0.5- 1.0 µm

            

小量生產設備    實驗設備


Deposition & Planarization
BOE / HF – Silicon dioxide EtchingStandard Operating Procedure
Dielectric Characteristics of Spin-coated Dielectric Films Using On-wafer Parallel-plate Capacitors at Microwave Frequencies
A novel thermally evaporated etching mask for low-damage dry etching
Smart-Cut Processing for Transfer of High-Temperature Ceramic Materials to Silicon
Spin-on Glass materials and applications in advanced IC technologies
Dielectrics by Growth and Deposition
Spin-on-glass bake and cure using a resistively heated batch annealing oven
Low temperature GaAs/Si direct wafer bonding

NanoPhosphors for white LEDs




If you don't find what you're looking for, Contact Us. We may have a suitable product that's not listed, or we may be able to develop a material to fit your specific needs. Tel : (02)2217-3442 / Fax : (02)2704-4070
 

 

 

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