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抑制電滲透流

 

披覆保護層
  壓印光子晶體結構

 

介電層凹陷孔洞填補

 

乾蝕刻圖案光罩
  絕緣層上覆矽
  低光耗損耐高溫
  微機電封裝
  次微米製程填隙
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

   

   
 返回首頁 > 產品與技術 > 旋塗被覆二氧化矽
 
 

旋塗式玻璃SOG (Spin-on glass)是液態SiO2,晶片旋塗SOG後可增加平坦性。為將SOG轉換成固態SiO2層,必須將晶片置於400~450的爐管,蒸除SOG內的溶劑

旋塗式玻璃
(spin-on glass; SOG) 是形成薄膜也是平坦化一種方式,將溶於溶劑中的介電物質旋轉塗佈在需要平坦化的晶片上,使介電物質隨著溶劑填入溝渠中,再經過高溫固化,形成近似二氧化矽的物質在晶片上,讓表面輪廓比較平滑達到局部平坦化的目的,使後續的製程得以順利進行。

 

 Spin-On Glass For Interlevel Dielectric and Protective Coating Applications

 Thickness Range  0.2 - 1.0 µm
 Performance  Low dielectric constant.
 Low tensile stress.
 Excellent adhesion to substrates.
 Superior shelf life during storage at room temperature.
 State-of-the-art planarization; controlled film thickness
 Excellent gap fill; very low defect density
 Choice of carrier solvent systems
 Applications  Dielectric smoothing layer for multilevel interconnects.
 Protective coating.


Deposition & Planarization
Spin-on-glass bake and cure using a resistively heated batch annealing oven
Low temperature GaAs/Si direct wafer bonding

NanoPhosphors for white LEDs




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