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Xenon Difluoride  XeF2
  Chlorine trifluoride (ClF3)
  Bromine Trifluoride (BrF3)
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

   

   
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System dimensions (not including attached subsystems): 720 mm wide X 650 mm deep X 1530 mm high
Height to top of LCD monitor: 1760 mm
Weight approximately: 225 kg
System Geometry
The
Xenon Difluoride Etching system is delivered in its standard configuration with two xenon difluoride expansion chambers and the provision for the installation of two xenon difluoride source bottles (not included with the system).

Wafer capacity
The
Xenon Difluoride Etching system is designed to be manually loaded for superior substrate geometry flexibility. This flexibility is a key feature since it allows the easy processing of MEMS devices ranging from die sized devices, very fragile or thin substrates, and standard full wafers.

Wafer size limitations
The
Xenon Difluoride Etching system includes two versions:

B model designed to accommodate 6" wafers or smaller parts
C model designed to accommodate 8" wafers or smaller parts






Xetch Xenon difluoride Etching system Lab procedure

 


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