材料受單位電壓下,單位體積儲存靜電能量為介電常數,介電常數愈小,電絕緣性愈佳。介電常數易受頻率、溫度、溼度影響,變化比其初始值重要,
產品的密閉性,若有空隙,通路因濕氣易腐蝕,受到電壓,空隙將行程電場集中現象,引起內部放電,導致絕緣破壞。製程中,低介電常數材料
提供
機械強度支撐多層連線的架構、高楊氏係數、高擊穿電壓、低漏電、高熱穩定性、良好的粘合強度、低吸水性、低薄膜應力、高平坦化、低熱漲係數以及與化學機械拋光製程相容性。滿足上述特性並不容易。如,薄膜的介電常數與熱傳導係數往往就呈反比關係。
low dielectric
constant Polymers For Next Generation Microelectronic Packaging![](icoLeaf.gif)
Novel Low
Dielectric Constant Thin Film Materials by Chemical Vapor Deposition![](icoLeaf.gif)
Nanoporous
Ultralow Dielectric Constant Organosilicates Templated by Triblock
Copolymers![](icoLeaf.gif)
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