廠商登入區員工登入區學術研究機構登入區    
 
  製品介紹 ・サービス
 

Photodielectric
  BPN Photoresist
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   


   

   
 返回首頁 > 產品與技術 > 平坦化光阻
 

 

Spin-On Photodielectrics are chemically amplified epoxy-based, negative-tone, multi-wavelength permanent dielectric materials. XBH dielectrics have a low Dk (2.8-2.9 @1Ghz) and low moisture absorbance. This Spin-On Dielectric can be used in applications such as wafer-level chip-scale packaging (WLCSP) re-distribution, passivation layers, covercoats and organic substrates. This material can easily substitute conventional materials such as polyimide and BCB. XBH Photodielectrics have wide processing windows with excellent resolution, thermal, electrical and mechanical properties.

8023 
Designed to be used with organic puddle development using TMAH Alkaline
developers.
8010 
Designed to be used with inorganic dip/spray development.
8011  Developer
Potassium hydroxide developer with aluminium corrosion inhibitor for  8010 photodielectric.
8012  Developer
Sodium hydroxide based developer for 8010 photodielectric.
BPN 
is a liquid negative tone photoresist formulated for wafer-level bump applications. This
product contains an environmentally safe solvent, Ethyle Lactate and is free of PGME and
PGMEA.

BPN is developed using TMAH Alkaline developers and is sensitive to both iLine and broadband
exposure.

This photoresist can be used on all metal and organic substrates. BPN is designed to fill the need for a ultra-thick single spin bump plating photoresist for WLP applications.

A range of viscosities are available that cover a film thickness of 30-1400m.


If you don't find what you're looking for, Contact Us. We may have a suitable product that's not listed, or we may be able to develop a material to fit your specific needs. Tel : (02)2217-3442 / Fax : (02)2704-4070
 

 

 

  Copyright and Disclaimerc © Xuan Bao Hao Corp.