Spin-On Photodielectrics are chemically amplified epoxy-based,
multi-wavelength permanent dielectric materials. XBH
dielectrics have a low Dk (2.8-2.9 @1Ghz) and low moisture
absorbance. This Spin-On Dielectric can be used in applications
such as wafer-level chip-scale packaging (WLCSP) re-distribution,
passivation layers, covercoats and organic substrates. This
material can easily substitute conventional materials such as
BCB. XBH Photodielectrics have
wide processing windows with excellent resolution, thermal,
Designed to be used with organic puddle development
using TMAH Alkaline
Designed to be used with inorganic dip/spray
Potassium hydroxide developer with aluminium corrosion inhibitor
for 8010 photodielectric.
Sodium hydroxide based developer for 8010
is a liquid
negative tone photoresist formulated for wafer-level bump
product contains an
environmentally safe solvent, Ethyle Lactate and is free of PGME
BPN is developed
using TMAH Alkaline developers and is sensitive to both iLine and
This photoresist can be
used on all metal and organic substrates. BPN is designed to fill
the need for a ultra-thick single spin bump plating photoresist
for WLP applications.
A range of viscosities
are available that cover a film thickness of 30-1400m.
If you don't find what you're looking for,
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070