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Spin-On Photodielectrics are chemically amplified epoxy-based,
negative-tone,
multi-wavelength permanent dielectric materials. XBH
dielectrics have a low Dk (2.8-2.9 @1Ghz) and low moisture
absorbance. This Spin-On Dielectric can be used in applications
such as wafer-level chip-scale packaging (WLCSP) re-distribution,
passivation layers, covercoats and organic substrates. This
material can easily substitute conventional materials such as
polyimide and
BCB. XBH Photodielectrics have
wide processing windows with excellent resolution, thermal,
electrical and
mechanical properties.
8023
Designed to be used with organic puddle development
using TMAH Alkaline
developers.
8010
Designed to be used with inorganic dip/spray
development.
8011 Developer
Potassium hydroxide developer with aluminium corrosion inhibitor
for 8010 photodielectric.
8012 Developer
Sodium hydroxide based developer for 8010
photodielectric.
BPN
is a liquid
negative tone photoresist formulated for wafer-level bump
applications. This
product contains an
environmentally safe solvent, Ethyle Lactate and is free of PGME
and
PGMEA.
BPN is developed
using TMAH Alkaline developers and is sensitive to both iLine and
broadband
exposure.
This photoresist can be
used on all metal and organic substrates. BPN is designed to fill
the need for a ultra-thick single spin bump plating photoresist
for WLP applications.
A range of viscosities
are available that cover a film thickness of 30-1400m.
If you don't find what you're looking for,
Contact Us.
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070
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