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Parylene, (polypara-xylylene). The process uses a thermal reactor to first vaporize (at 150 °C, 1 torr pressure), and pyrolyze (at 680 °C, 0.5 torr pressure) the di-para-xylene then polymerizes the dimer into polymer at room temperature. This room temperature deposition is a very attractive encapsulation process, especially for temperature sensitive, low glass transition substrate materials. Parylene deposition provides an excellent conformal step-coverage and conformal film with thickness ranging from 2 µm to 50 µm.

The high cost of the starting dimer and the deposition equipment may prohibit its widespread use in consumer electronic applications. Nevertheless, it is a unique conformal coating material with potential coating applications.
 

耐高溫性能
ASTM E1131

熱穩定性

>460 º C

耐氣候性能
ASTM G154
耐紫外線性 小時

>2500

摩擦係數
ASTM D1894

靜態

0.143

動態

0.128

電氣常量 介質損耗
ASTM D150,RT

60赫茲

0.0002 Hz

1千赫茲

0.0020 KHz

1兆赫茲

0.0010 MHz

 

介電常數
ASTM D150,RT

 

60赫茲

2.25 Hz

1千赫茲

2.21 KHz

1兆赫茲

2.16 MHz

ASTM D149,RT 介電強度  伏特/密耳

5500

遮罩常量
ASTM D570

吸水性

<0.009 %

ASTM F1249 WVTR  克 /100 寸 ² - 天

0.59

 

氣體穿透性
Mocon MULTI-TRAN 400

 

CO2

95.6

N2

4.85

O2

23.5


If you don't find what you're looking for, Contact Us. We may have a suitable product that's not listed, or we may be able to develop a material to fit your specific needs. Tel : (02)2217-3442 / Fax : (02)2704-4070
 

 

 

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