|
Parylene, (polypara-xylylene). The
process uses a thermal reactor to first vaporize (at 150 °C, 1
torr pressure), and pyrolyze (at 680 °C, 0.5 torr pressure) the
di-para-xylene then polymerizes the dimer into polymer at room
temperature. This room temperature deposition is a very attractive
encapsulation process, especially for temperature sensitive, low
glass transition substrate materials. Parylene deposition provides
an excellent conformal step-coverage and conformal film with
thickness ranging from 2 µm to 50 µm.
The high cost of the starting dimer and the deposition equipment
may prohibit its widespread use in consumer electronic
applications. Nevertheless, it is a unique conformal coating
material with potential coating applications.
|
耐高溫性能
ASTM E1131 |
熱穩定性 |
>460
º C |
耐氣候性能
ASTM G154 |
耐紫外線性 小時 |
>2500 |
|
摩擦係數
ASTM D1894 |
靜態 |
0.143 |
|
動態 |
0.128 |
|
電氣常量
介質損耗
ASTM D150,RT |
60赫茲 |
0.0002
Hz |
|
1千赫茲 |
0.0020
KHz
|
|
1兆赫茲 |
0.0010
MHz
|
|
介電常數
ASTM D150,RT
|
60赫茲 |
2.25
Hz
|
|
1千赫茲 |
2.21 KHz |
|
1兆赫茲 |
2.16
MHz
|
|
ASTM D149,RT |
介電強度 伏特/密耳 |
5500 |
|
遮罩常量
ASTM D570 |
吸水性 |
<0.009
% |
|
ASTM F1249 |
WVTR 克
/100
寸
²
- 天 |
0.59 |
|
氣體穿透性
Mocon MULTI-TRAN 400
|
CO2
|
95.6 |
|
N2 |
4.85 |
|
O2 |
23.5 |
If you don't find what you're looking for,
Contact Us.
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070
|
|
