This technology deposits electronic materials onto low-temperature,non-conformal
substrates without masks or resists.
A neglected middle ground exists in microelectronic fabrication.
Major manufacturing techniques are designed to deposit very small
electronic features and relatively large ones. But no deposition
technology currently on the market is aimed at crucial midsize
components such as resistors, capacitors and inductors. However, a
new technology for producing midsize electronic features has
recently been developed. Without masks or resists, this technology
can write lines of electronic materials less than 25 μm wide onto
polymer, glass or ceramic substrates, for manufacturing of printed
wiring boards (PWBs) and other devices.
is a valuable tool for product development because it
generates circuitry on PCBs directly from a CAD file.
makes it much easier to implement and validate design changes
without the need for legacy mask sets and other accessories
required by conventional deposition techniques. The
elimination of masks and resists also permits on-the-fly
changes and rapid design iterations. The result is faster
time-to-market for new products.
μm line width
deposition over varying topologies with no change in Z
μm line width
Direct Printing of Circuit Boards Using
Optimizing Aerosol Jet® Printing Of Silver
Interconnects On Polyimide Film For Embedded Electronics
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able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070