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ASM-8000
It equips with 4 cassettes and Concurrent running (Bake, Coat, Develop) is possible.




 

ASM-8000 Photoresist Developer Lithographic process system with flexible material flow, modular design and high throughput. Process modules with pick and place robot handling for wafers as well as for a variety of other substrates up to 150 mm (6"). Set up for 100mm (4") wafers. (optional 75mm, 150mm (3", 6") Small footprint, only 700mm (28") wide, 1200mm (48") deep. System consists of: * Sender/Receiver module for Standard Cassettes * Frogleg Robot * Developer Module with 5 Spray and Puddle nozzles for developer and DI Water * 2 each stacked Hotplates * Coolplate Kuhnke 653 W Programmable Process Controller and ILONA menu controller at operator interface, onscreen operator guidance, single wafer data acquisition and record keeping, Host computer and CIM interface (SECS I/II) Including 2 Chiller and 2 Canisters for Developer.


Recent Developments, Issues and Challenges for Lithography in ULSI Fabrication
Patterning: Principles and Some NewDevelopments
 


 


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