It equips with 4 cassettes and Concurrent running (Bake, Coat,
Develop) is possible.
ASM-8000 Photoresist Developer Lithographic
process system with flexible material flow, modular design and
high throughput. Process modules with pick and place robot
handling for wafers as well as for a variety of other
substrates up to 150 mm (6"). Set up for 100mm (4") wafers.
(optional 75mm, 150mm (3", 6") Small footprint, only 700mm
(28") wide, 1200mm (48") deep. System consists of: *
Sender/Receiver module for Standard Cassettes * Frogleg Robot
* Developer Module with 5 Spray and Puddle nozzles for
developer and DI Water * 2 each stacked Hotplates * Coolplate
Kuhnke 653 W Programmable Process Controller and ILONA menu
controller at operator interface, onscreen operator guidance,
single wafer data acquisition and record keeping, Host
computer and CIM interface (SECS I/II) Including 2 Chiller and
2 Canisters for Developer.
Recent Developments, Issues and Challenges
for Lithography in ULSI Fabrication
Principles and Some NewDevelopments
If you don't find what you're looking for,
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070