HM-ACF是一種具有可靠黏结性的
異方性導電的特殊膠膜，含各種類型ACF，適用于TAB，COG，COB，COF，等离子液晶顯示等各種壓接。
優點 : 降低翹曲量 ,
楊氏係數、熱膨脹係數較高
Unique
highly thermally conductive carbon fibers (1900 W/m°K) are used to create
a Z-axis bulk thermal conductivity of 750 W/m°K (at 40% fiber
volume)...twice the thermal conductivity of pure copper.
HM-ACF Thermally Conductive Adhesive Film is currently being evaluated
for a variety of
applications,
including
microprocessor die
attach, Thermal
Interface Material,
LED assembly, heat
pipe attachment, heat
sink attachment and
fluid cooling system
assembly.
8µ diameter pure
nickel fibers
4µ
diameter process
capability
Instant “cure” hot
melt thermoplastic
125°C to 200°C
bonding temperature
options
90°C to
160°C continuous
operating capability
Medium pitch
density 100
series
uncoated
pure nickel fibers
continuous process,
<30% cost of high
pitch version
High pitch
density 200
series
heat treat
Ni fibers in
oxygen/argon to grow
¼ µ thick green
nickel oxide coating
(NiO)
>20
mega-ohm resistance
on 30µ comb pattern
11µ pitch capability
