HM-ACF是一種具有可靠黏结性的
異方性導電的特殊膠膜,含各種類型ACF,適用于TAB,COG,COB,COF,等离子液晶顯示等各種壓接。
優點 : 降低翹曲量 ,
楊氏係數、熱膨脹係數較高
Unique
highly thermally conductive carbon fibers (1900 W/m°K) are used to create
a Z-axis bulk thermal conductivity of 750 W/m°K (at 40% fiber
volume)...twice the thermal conductivity of pure copper.
HM-ACF Thermally Conductive Adhesive Film is currently being evaluated
for a variety of
applications,
including
microprocessor die
attach, Thermal
Interface Material,
LED assembly, heat
pipe attachment, heat
sink attachment and
fluid cooling system
assembly.
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8µ diameter pure
nickel fibers
4µ
diameter process
capability
Instant “cure” hot
melt thermoplastic
125°C to 200°C
bonding temperature
options
90°C to
160°C continuous
operating capability
Medium pitch
density 100
series
uncoated
pure nickel fibers
continuous process,
<30% cost of high
pitch version
High pitch
density 200
series
heat treat
Ni fibers in
oxygen/argon to grow
¼ µ thick green
nickel oxide coating
(NiO)
>20
mega-ohm resistance
on 30µ comb pattern
11µ pitch capability