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CIF Sensors : 10萬畫素, 1/5”, 1/6”
  VGA Sensors : 30萬畫素,1/3”, 1/4”
  SVGA Sensors : 48萬畫素, 1/3”
  SXGA Sensors : 130萬畫素, 1/2”, 1/3”
  VXGA Sensors : 200萬畫素, 1/2”, 1/3”
  XVGA Sensor Module : 30萬畫素, 1/4”, 5lux, 含Lens 及FPC
  Backend chips : Integrated Audio A/D, USB1.1 transceiver
  Analog sensor with NTSC/PAL format : 30萬畫素,1/3”, 1/4”
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

   

   
 產品與技術 > 影像感測模組 > 產業新聞 > 常見問答
 
 

XBH develops smallest camera module with area reduced by 1/3, to 6mm! (compared to conventional 10mm)
Camera Module

Overview
The market for cellular telephones that incorporate cameras is growing annually.
The themes of the  camera module are small size, light weight and compactness. It uses a 1/6-inch VGA CMOS sensor and short focus lens to achieve reduced size of 6mm x 6mm x 4.5mm, and supports 330,000 pixels.

Features
Low profile module, at 4.5mm high
Supports side contact connectors
Supports different types of flexible printed circuit boards
Easy barrel replacement allows selection of required lens

Connectors are available from David Lu Group.

Main Specifications
 

Sensor process

CMOS

Image size

1/6 inch VGA

No. of pixels recorded

660(H) x 492(V) pixel (approx. 330,000 pixels)

Power supply voltage

2.8±0.2V & 1.5±0.15V

External dimensions

6mm x 6mm x 4.5mm (camera body)

 

Recently released XBH and Micron VGA sensors versus the Omnivision OV7648/9*

Item

XBH Camera module

Micron MT9V011/MT9V111

Omnivision OV7648/9 SoC

Launch

Announced January 2004, samples in March, mass production in May

February 2004 (already in mass production)

Mass production in March/April 2003

Optical lens size

1/6-inch

1/4-inch

1/4-inch

Resolution

VGA

Pixel pitch

3.75μm (square)

5.6μm (square)

5.6μm (square)

Frame rate (max at full resolution, frames per second)

30

Power supply

2.8±0.2V or 1.5±0.15V (sensor/photo diode and I/O) and 1.5±0.1V (logic)

2.8V (2.55V-3.05V)

2.5V±10% (core), 2.5V±4% (analog), 2.25V-3.3V (I/O).

Power consumption

 40mW at 30fps

MT9V011: 60mW at 30fps,
MT9V111 SoC: 80mW at 30fps.

40mW at 30fps (including I/O power)

Size

Module: 6mm square, 4.5mm depth (without socket)

N/A

Chip: 4.93mm square, 4.76mm high


XBH’s tiny new VGA camera module and socket next to a metric ruler (cm). Courtesy of XBH

The new sensor’s 330,000 pixels are arranged in a 492 by 660 array and each has been reduced from 5.4 microns to 3.75 microns by advances in XBH’s manufacturing process. According to the company, the design optimization and move to a 0.18-micron process from the original 0.35-micron has not only helped the form factor, it has also reduced the power consumption. The Camera module combines a single chip containing the sensor and a digital signal processor (DSP) with a double lens. The whole module measures just 6mm square with a depth of 4.5mm (without socket), a 72% reduction in volume compared with XBH’s currently available module.

At minimum scene illumination levels as low as three lux, XBH is claiming to be able to match CCD performance with its new chips. Incorporating a photodiode double the size of XBH’s current devices, and with double the sensitivity, the new chips offer much-improved performance in low light conditions. XBH also claims success in cutting leakage current, an advance that cuts the dark signal voltage to one-third that of present CMOS image sensors. In addition, an optimized analog-digital converter and pixel design also produce less noise and contribute to better image quality.

產品特色在於耗電量極低、影像品質接近
CCD、封裝的精密度高,一般CMOS Sensor耗電量約為3.3V,XBH的產品耗電量則為2.8V。
XBH
的新感測器內建了一個光電二極體,並藉由減少光電二極體所產生的暗電流,支援在較暗燈光下的正常攝影功能;在加入這個光電二極體後,新的CMOS Sensor體積仍與現有產品相同,並沒有增加。另外,新元件的雜訊輸出電壓也較現有的CMOS Sensor減少了三分之一。

 


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