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PDMS has
Low
stress, higher modulus, low-temperature thermal cure, high thermal
stability, low shrinkage, good moisture resistance, good
dielectric properties, negative tone patternable to an aspect
ratio less than 1.3 with sloping sidewalls, demonstrated device
integration, easily rework
and low
interfacial free energy such that molecules of most polymers won’t
stick on or react with its surface. The interfacial free energy
can be manipulated with plasma treatment.
PDMS is stable against humidity temperature.
PDMS is optically transparent and can be cured by UV light.
PDMS can attach on nonplanar surfaces.
PDMS is mechanically durable.
Disadvantages: Volume change and elastic deformation.
Recommended aspect ratio: 0.2-2
processes
:
Spin coat
Soft bake
UV exposure
Post-exposure bake
Development
Hard bake
Ancillary products are available for edge bead removal, rinse,
development and
rework (stripping).
Description :
Colorless, transparent solution of silicone-based material in
mesitylene for
spin-coating and photolithographic processing.
Potential Uses
:
Front and backside wafer protective layer; stress-buffer layer
applications;
redistribution layer; soldermask; negative
photoresist; adhesive layer; sacrificial layer
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spin-coating speed rpm |
500 |
1000 |
1500 |
2000 |
3000 |
4000 |
5000 |
6000 |
8000 |
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PDMS thickness μm
measurements |
220 |
77 |
52 |
36 |
28 |
19 |
13 |
|
8 |
|
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|
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20 |
|
12 |
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Phospholipid
biotinylation of
polydimethylsiloxane
(PDMS) for protein
immobilization
Photodefinable
polydimethylsiloxane
(PDMS) for rapid
lab-on-a-chip
prototyping
If you don't find what you're looking for,
Contact Us.
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070
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