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There are several optical and thermo-mechanical
requirements for the lightpipe material used in CMOS image sensors. The
refractive index must be higher than that of the surrounding material to
enable total internal reflection and the material must be optically highly
transparent. Sufficient thermal and environmental stability is required for
the material to be able to withstand the subsequent process steps and pass
device reliability testing. Since the material will be within close
proximity to the pixel’s photodiode and transistor structures, it also has
to be free of any contaminants which could degrade the device performance.
Below shows basic film properties of XBHs’ high refractive index polymers
from the DL-product series. The materials have been specifically tailored to
meet the requirements of the lightpipe application.
General
Physical Property Information
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DL300 |
DL400 |
DL500 |
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Refractive Index
632.8nm |
1.665 |
1.647 |
1.816 |
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Extinction
coefficient
λ
>
400nm
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<1.0E-3 |
<1.0E-3 |
<2.0E-3 |
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Dielectric constant
100 kHz |
3.6 |
3.2 |
7.5 |
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Leakage current
density
1.0 MV/cm
field nA/cm2 |
0.3 |
0.1 |
NA |
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Young’s Modulus
GPa |
7.0 |
8.3 |
18.9 |
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Hardness
GPa |
0.41 |
0.50 |
0.79 |
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Stress
RT MPa |
37 |
49 |
NA |
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Film Shrinkage
% |
2 |
4.5 |
9 |
Film cured at 200°C/5
min, Film cured at 400°C/60
min, Film cured at 300°C/10
min, Refractive index is tunable, Measured with nanoindentation,
Measured between softbake and final cure.
If you don't find what you're looking for,
Contact Us.
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070
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