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Heat it's one of the
major enemies of today's
electronic components
and assemblies. It
shortens service life
and threatens
reliability. Everyday
the challenge grows
greater as designers and
fabricators are asked to
produce assemblies that
are smaller and faster,
making the need for heat
dissipation greater than
ever before.
Boron Nitride (BN)
fillers solve the
problem. When used in a
variety of polymeric
materials, Boron
Nitride's heat
dissipating capability
helps extend the service
life and enhance the
reliability of
electronic components
and assemblies.
Boron Nitride Fillers:
The Cool Choice
Compare the thermal
conductivity of Boron
Nitride fillers to other
fillers such as fused
silica, aluminum oxide,
and aluminum nitride.
Boron Nitride
outperforms these
materials when used as a
filler in polymeric
materials. Some polymer
materials with Boron
Nitride fillers have
achieved thermal
conductivity levels as
high as 15W/mK.
Molecular Dynamics
Simulations of
Mechanical Properties of
Boron-Nitride Nanotubes
Embedded in Si-B-N
Ceramics
From Graphene Sheets to
Boron Nitride Nanotubes
via a Carbon-Thermal
Substitution Reaction
Properties and
Structures of Vitreous
and Crystalline Boron
Oxide
If you don't find what you're looking for,
Contact Us.
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070
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